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Leading Plasma Innovations

The Semiconductor Business Group focuses on plasma processes for advanced semiconductor packaging and assembly (ASPA), wafer level packaging (WLP), microelectromechanical systems (MEMS), data storage devices such as thin film read-write heads (TFH) for hard disk drives, and images sensors.

Applications > Functionalize >

Functionalize

The process of functionalization involves the reaction of plasma generated radicals with the sample surface resulting in the addition of specific chemical functionality to the material surface. For example, amino (NH2) functionality can be added to the surface by utilizing ammonia as a plasma process gas. Other chemistries can yield oxides, hydroxides, and carboxyl groups. Functionalizing the surface with plasma is a common technology used to improve bonding between incompatible materials. It helps facilitate strong chemical bonds between the adhesive and the bonding materials. Functionalization can also allow for the attachment of an anti-coagulant such as heparin and anti-viral or anti-microbial molecules to surfaces. Contact lens treatment is a common functionalization application where the lens surface is oxidized to create a hydrophilic lens surface that is resistant to protein deposition.

 

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Semiconductor

Semiconductor Advanced Packaging

The Semiconductor Business Group focuses on plasma processes for advanced semiconductor packaging and assembly (ASPA), wafer level packaging (WLP), microelectromechanical systems (MEMS), data storage devices such as thin film read-write heads (TFH) for hard disk drives, and images sensors. More>>>

Medical Device

Life Sciences

The Medical Device Business Group is engaged in providing enhanced product performance, more reliable devices and lower cost processes to companies who manufacture leading edge medical devices including cardiac rhythm management products, catheters, stents, ocular devices, and filter media.
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Printed Circuit Board

PCB

Printed circuit board manufacturers work with our PCB Business Group due to the implementation of new materials technology, and smaller geometries in HDI, flex, and rigid flex applications. More>>>

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