Applications > Printed Circuit Boards > Teflon Activation
Teflon Activation
Surface activation for double-sided and multi-layer Teflon through-hole boards is necessary to increase surface wettability. Chemical processes do not have the flexibility to treat Teflon and other resins mixed in the same panel. However, a single plasma process can modify Teflon surfaces and desmear resins, effectively preparing hole walls for electro-less copper or direct metalization.
The figures below displays a untreated Teflon panel on the left where a water droplet beads on the hydrophobic surface. The figure on the right shows the effect of plasma by improving the wettability of the Teflon surface.
The figures below displays a untreated Teflon panel on the left where a water droplet beads on the hydrophobic surface. The figure on the right shows the effect of plasma by improving the wettability of the Teflon surface.
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PCB Applications Team
James Getty, PCB Market Manager
Getty leads March’s Applications Engineering and Business Development activities, including the Marketing activities supporting the business’ Semiconductor, Printed Circuit Board, and Life Sciences market segments. Getty joined March in 2000. Prior to March Getty has held positions in the semiconductor industry. Getty has a BS, Chemistry from the University of California at Irvine and a PhD in Physical Chemistry from the University of California at Davis.
Lou Fierro, Applications Development Manager, PCB
Lou Fierro joined March Plasma Systems in 1997. Prior to coming to March he spent more than 23 years in engineering, building rigid, flex and exotic printed circuit boards. He now manages applications and contract service at March Plasma Systems Florida facility. Lou is also responsible for process development and technical support.
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