Applications > Semiconductor > Wafer Level > BCM and UBM Adhesion
BCM and UBM Adhesion
Polymers, such as benzocyclobutene (BCB), are dispensed on the wafer and act as a dielectric for the redistribution layer. Plasma alters the topography and wettability of the wafer’s original passivation layer to promote adhesion. Plasma promotes UBM in the same manner.
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Semiconductor Applications Team
Scott Szymanski, Semiconductor Market Manager
Mr. Szymanski works to expand strategic alliances, strengthen partnerships with equipment suppliers, and develop future product offerings tailored to the semiconductor market. With 10+ years of experience at major semiconductor companies, he holds a B.S. degree in Mechanical Engineering from UCLA, and an M.B.A. from the University of Phoenix.
Peter Huang, Semiconductor Applications Engineer
Mr. Huang joined March Plasma Systems in 2006. Prior to his appointment at March he has held a variety of positions in L3 Communications, Raytheon and Texas Instruments. Huang has a BS from Chung Yuan University in Taiwan and a MS from the University of Houston.
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